MEMS Pressure Transducer

Description

The sensor chip is manufactured by advanced bulk micromechanical process. The piezoresistive chip is coated with silicon gel or housed in a fluid filled cylindrical cavity and isolated from measured media by stainless steel diaphragm package. Stainless steel diaphragm package can be implement under extreme environments like corrosive environment.

Features

◆ Silicon Piezoresistive Sensor ◆ Ratiometric output ◆Stainless steel diaphragm package or silicon gel package ◆Pressure Range(Optional)：0~10MPa ◆Wide operation temperature range(-40~85 ℃ or -40~125 ℃) ◆High stability, high reliability, low consumption and low cost ◆ Error：±1％~±3% of output voltage over full temperature range ◆ Overload Protection ◆ EMC authentication (ISO11452-5) ◆Compact & robust structure

Specifications Pressure Range(Optional) 0~10MPa Technique Type Piezoresistive Supply Voltage 5±5%VDC Maximum Supply Voltage 8mA Output type Ratiometric Maximum Output Current 1.0mA Operation Temperature Range -40~125 ℃ -40~85 ℃ Linearity ±0.20%FSO Temperature Coefficient Sensitivity ±0.45%FSO/℃ Overload Capability x2.5 Hysteresis and Repeatibility ±0.45%FSO Assembly Moment 12~15Nm Output load 33kΩ

Applications ◆Aviation and space ◆Industrial auto control ◆Automobile Engine Control Unit or brake control unit ◆Automotive air-condition ◆Traditional Air and liquid Pressure measurement ◆Corrosive air and liquid pressure measurement

Package Dimensions	Unit：mm